US 12,255,276 B2
Method for manufacturing image display device and image display device
Hajime Akimoto, Anan (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Nov. 9, 2021, as Appl. No. 17/522,497.
Application 17/522,497 is a continuation of application No. PCT/JP2020/018398, filed on May 1, 2020.
Claims priority of application No. 2019-090020 (JP), filed on May 10, 2019.
Prior Publication US 2022/0069188 A1, Mar. 3, 2022
Int. Cl. H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 33/32 (2010.01); H01L 33/42 (2010.01); H01L 33/44 (2010.01); H01L 33/50 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 33/0075 (2013.01); H01L 33/32 (2013.01); H01L 33/42 (2013.01); H01L 33/44 (2013.01); H01L 33/50 (2013.01); H01L 33/0093 (2020.05); H01L 2933/0025 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for manufacturing an image display device, the method comprising:
providing a semiconductor growth substrate comprising a semiconductor layer on a first substrate, the semiconductor layer comprising a light-emitting layer;
providing a second substrate comprising a circuit and a first wiring layer, wherein the circuit comprises a circuit element, and the first wiring layer is electrically connected to the circuit element;
forming a light-shielding layer on the second substrate;
forming an insulating film on the light-shielding layer;
bonding the semiconductor layer to the second substrate on which the insulating film is formed;
forming a light-emitting element by etching the semiconductor layer;
forming an insulating layer that covers the light-emitting element; and
electrically connecting the light-emitting element to the circuit element, wherein:
the light-shielding layer is located between the light-emitting element and the first wiring layer, and
in a plan view, the light-shielding layer covers the circuit element.