US 12,255,220 B2
Light receiving element and electronic apparatus
Shuji Manda, Kanagawa (JP); Ryosuke Matsumoto, Kanagawa (JP); Suguru Saito, Kanagawa (JP); Shigehiro Ikehara, Kanagawa (JP); Tetsuji Yamaguchi, Kanagawa (JP); and Shunsuke Maruyama, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed on Jan. 18, 2023, as Appl. No. 18/156,189.
Application 18/156,189 is a continuation of application No. 16/956,128, granted, now 11,616,093, previously published as PCT/JP2018/045704, filed on Dec. 12, 2018.
Claims priority of application No. 2017-253637 (JP), filed on Dec. 28, 2017.
Prior Publication US 2023/0223420 A1, Jul. 13, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14669 (2013.01) [H01L 27/14623 (2013.01); H01L 27/14685 (2013.01); H01L 27/14694 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A light receiving element, comprising:
a plurality of pixels;
a photoelectric converter that includes a compound semiconductor material, is provided as a layer common to the plurality of pixels, and has a stacked structure in which a photoelectric conversion layer, a first contact layer, and a second contact layer are stacked, the photoelectric conversion layer being provided between the first contact layer and the second contact layer; and
an insulating layer provided over the photoelectric converter,
wherein the insulating layer includes a carrier-induction film.