US 12,255,215 B2
Imaging element and imaging device
Kazuki Sakoda, Kumamoto (JP); Yusuke Uesaka, Kanagawa (JP); and Susumu Inoue, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/753,599
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Jul. 16, 2020, PCT No. PCT/JP2020/027703
§ 371(c)(1), (2) Date Mar. 9, 2022,
PCT Pub. No. WO2021/053952, PCT Pub. Date Mar. 25, 2021.
Claims priority of application No. 2019-168138 (JP), filed on Sep. 17, 2019.
Prior Publication US 2022/0336512 A1, Oct. 20, 2022
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14625 (2013.01) [H01L 27/1461 (2013.01); H01L 27/14621 (2013.01); H01L 27/14623 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An imaging element, comprising:
a plurality of pixels, wherein each pixel of the plurality of pixels includes a polarization unit and a photoelectric conversion unit in a semiconductor substrate, wherein
the polarization unit is configured to polarize incident light in a specific polarization direction, and
the photoelectric conversion unit is configured to perform photoelectric conversion of the polarized incident light;
a plurality of separation regions in the semiconductor substrate, wherein the plurality of separation regions is configured to separate the plurality of pixels; and
a non-separation region in the semiconductor substrate and adjacent to an intersection of a set of separation regions of the plurality of separation regions.