US 12,255,198 B2
Layouts of data pads on a semiconductor die
Takamasa Suzuki, Kanagawa (JP)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Dec. 30, 2021, as Appl. No. 17/646,565.
Prior Publication US 2023/0215858 A1, Jul. 6, 2023
Int. Cl. H01L 27/02 (2006.01); G11C 5/06 (2006.01); H01L 25/065 (2023.01)
CPC H01L 27/0207 (2013.01) [G11C 5/063 (2013.01); H01L 25/0657 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A die comprising:
a number of circuits;
a first edge;
a second edge perpendicular to the first edge;
a third edge opposite the first edge;
a fourth edge opposite the second edge;
a first number of data pads variously electrically coupled to the number of circuits, the first number of data pads arranged proximate to the first edge;
a first number of dummy data pads not electrically coupled to the number of circuits, alternatingly arranged with the first number of data pads, proximate to the first edge, with a first data pad of the first number of data pads proximate to the fourth edge and a first dummy data pad of the first number of dummy data pads proximate to the second edge;
a second number of data pads variously electrically coupled to the number of circuits, the second number of data pads arranged proximate to the third edge; and
a second number of dummy data pads not electrically coupled to the number of circuits, alternatingly arranged with the second number of data pads, proximate to the third edge, with a second data pad of the second number of data pads proximate to the fourth edge and a second dummy data pad of the second number of dummy data pads proximate to the second edge,
wherein the first number of data pads, the first number of dummy data pads, the second number of data pads, and the second number of dummy data pads are arranged such that if the die were rotated substantially 180° around an axis between the first edge, the second edge, the third edge, and the fourth edge, the first number of data pads would be in first positions formerly occupied by the second number of dummy data pads, the first number of dummy data pads would be in second positions formerly occupied by the second number of data pads, the second number of data pads would be in third positions formerly occupied by the first number of dummy data pads, and the second number of dummy data pads would be in fourth positions formerly occupied by the first number of data pads.