US 12,255,191 B2
Semiconductor device
Hideki Sawada, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Appl. No. 17/626,070
Filed by ROHM CO., LTD., Kyoto (JP)
PCT Filed Sep. 7, 2020, PCT No. PCT/JP2020/033835
§ 371(c)(1), (2) Date Jan. 10, 2022,
PCT Pub. No. WO2021/059947, PCT Pub. Date Apr. 1, 2021.
Claims priority of application No. 2019-177885 (JP), filed on Sep. 27, 2019.
Prior Publication US 2022/0254764 A1, Aug. 11, 2022
Int. Cl. H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H02M 1/32 (2007.01); H02M 7/48 (2007.01)
CPC H01L 25/162 (2013.01) [H01L 23/3121 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H02M 1/32 (2013.01); H02M 7/48 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a semiconductor element;
a support substrate that supports the semiconductor element;
a conductor electrically connected to the semiconductor element; and
a resin member that encapsulates the semiconductor element, wherein
the conductor includes a mounting region on which an electronic component is mounted, and
the resin member includes a resin opening that exposes the mounting region,
the semiconductor device further comprises a conductive substrate serving as the conductor and including a conductive portion of a metal layer formed on a substrate that is electrically insulative,
the semiconductor element is electrically connected to the conductive portion of the conductive substrate,
the support substrate supports the conductive substrate,
the resin member encapsulates the conductive substrate,
the mounting region includes the conductive portion to mount the electronic component,
the semiconductor element includes a first drive electrode and a second drive electrode,
the conductive portion includes a drive conductive portion electrically connected to the first drive electrode, and
the resin opening includes a drive side opening that exposes part of the drive conductive portion.