US 12,255,185 B2
Systems and methods for multi-color LED with stacked bonding structures
Qunchao Xu, Shanghai (CN); and Qiming Li, Albuquerque, NM (US)
Assigned to JADE BIRD DISPLAY (SHANGHAI) LIMITED, Shanghai (CN)
Filed by Jade Bird Display (Shanghai) Limited, Shanghai (CN)
Filed on Mar. 30, 2021, as Appl. No. 17/217,484.
Claims priority of provisional application 63/002,092, filed on Mar. 30, 2020.
Prior Publication US 2021/0305220 A1, Sep. 30, 2021
Int. Cl. H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/08 (2010.01); H01L 33/38 (2010.01); H01L 33/62 (2010.01)
CPC H01L 25/0753 (2013.01) [H01L 33/0093 (2020.05); H01L 33/08 (2013.01); H01L 33/387 (2013.01); H01L 33/62 (2013.01); H01L 2933/0066 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A multi-color light-emitting diode (LED) pixel device for a display panel, comprising:
an IC substrate, the IC substrate defining a horizontal direction along a length of the IC substrate and a vertical direction along a height of the IC substrate;
a first LED structure on top of the IC substrate along the vertical direction, comprising a first light emitting layer; and
a second LED structure on top of the IC substrate along the vertical direction, comprising a second light emitting layer and a third light emitting layer on top of the second light emitting layer;
wherein:
the first LED structure and the second LED structure are arranged along the horizontal direction on top of the IC substrate, the first light emitting layer in the first LED structure and the second light emitting layer in the second LED structure being substantially aligned along the horizontal direction;
the first LED structure is configured to generate a first color light emitted from the first light emitting layer;
the second LED structure is configured to generate a second color light emitted by the third light emitting layer, and no light is emitted from the second light emitting layer;
the first light emitting layer comprises a first semiconductor layer and a second semiconductor layer on top of the first semiconductor layer;
the second light emitting layer comprises a third semiconductor layer and a fourth semiconductor layer on top of the third semiconductor layer;
the third light emitting layer comprises a fifth semiconductor layer and a sixth semiconductor layer on top of the fifth semiconductor layer;
each of the first semiconductor layer, the third semiconductor layer, and the sixth semiconductor layer comprises a first-type semiconductor;
each of the second semiconductor layer, the fourth semiconductor layer, and the fifth semiconductor layer comprises a second-type semiconductor;
in the first LED structure, the second semiconductor layer electrically connects to the IC substrate with a first electrode, a first end of the first electrode in direct contact with a top surface of the second semiconductor layer and a second end of the first electrode in direct contact with the IC substrate;
in the second LED structure, the fifth semiconductor layer electrically connects to the IC substrate with a second electrode, a first end of the second electrode electrically connecting a bottom of the fifth semiconductor layer, a second end of the second electrode in direct contact with the IC substrate, and a sidewall of the second electrode contacting a sidewall of the second light emitting layer; and
a top transparent conductive layer covers a top surface and a side surface of each of the first LED structure and the second LED structure, the top transparent conductive layer in direct contact with the first semiconductor layer in the first LED structure and a top surface of the sixth semiconductor layer in the second LED structure.