US 12,255,184 B2
Semiconductor packages and methods of forming the same
Chen-Hua Yu, Hsinchu (TW); Ming Hung Tseng, Miaoli County (TW); Yen-Liang Lin, Taichung (TW); Tzu-Sung Huang, Tainan (TW); Tin-Hao Kuo, Hsinchu (TW); and Hao-Yi Tsai, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed on Jun. 16, 2023, as Appl. No. 18/336,592.
Application 18/336,592 is a continuation of application No. 17/222,041, filed on Apr. 5, 2021, granted, now 11,682,655.
Application 17/222,041 is a continuation of application No. 16/390,275, filed on Apr. 22, 2019, granted, now 10,971,477, issued on Apr. 6, 2021.
Application 16/390,275 is a continuation of application No. 15/782,993, filed on Oct. 13, 2017, granted, now 10,269,773, issued on Apr. 23, 2019.
Claims priority of provisional application 62/565,321, filed on Sep. 29, 2017.
Prior Publication US 2023/0335536 A1, Oct. 19, 2023
Int. Cl. H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/76871 (2013.01); H01L 21/76877 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 23/5389 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 21/563 (2013.01); H01L 23/3107 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/214 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15311 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a first redistribution structure comprising a first conductive line and a second conductive line;
an integrated circuit die attached to the first redistribution structure;
a first via coupled to the first conductive line on a first side;
a first conductive connector coupled to the first conductive line on a second side opposite the first side
a second via coupled to the second conductive line on the first side; and
a second conductive connector coupled to the second conductive line on the second side,
wherein the first via directly contacts the first conductive line without directly contacting the first conductive connector,
wherein the second via directly contacts the second conductive line and directly contacts the second conductive connector.