US 12,255,182 B2
Electronic package and manufacturing method thereof
Meng-Huan Chia, Taichung (TW); Yih-Jenn Jiang, Taichung (TW); Chang-Fu Lin, Taichung (TW); and Don-Son Jiang, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Aug. 17, 2023, as Appl. No. 18/235,079.
Application 18/235,079 is a continuation of application No. 17/411,228, filed on Aug. 25, 2021, granted, now 11,764,188.
Claims priority of application No. 110125877 (TW), filed on Jul. 14, 2021.
Prior Publication US 2023/0395571 A1, Dec. 7, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01)
CPC H01L 25/0657 (2013.01) [H01L 25/162 (2013.01); H01L 25/50 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06589 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a circuit structure having a first side and a second side opposing the first side;
a first electronic element disposed on the first side of the circuit structure;
at least one thermally conductive pillar disposed on the second side of the circuit structure and extending into the circuit structure; and
a second metal layer formed on the thermally conductive pillar, wherein the second metal layer thermally conducts the thermally conductive pillar and dissipates heat to an external environment.