US 12,255,180 B2
3D package configuration
Tung-Po Sung, Taoyuan (TW); and Chang-Cheng Lo, Taoyuan (TW)
Assigned to CCS Technology Corporation, Taoyuan (TW)
Filed by CCS Technology Corporation, Taoyuan (TW)
Filed on Feb. 23, 2022, as Appl. No. 17/678,204.
Application 17/678,204 is a continuation in part of application No. 17/158,080, filed on Jan. 26, 2021, granted, now 11,373,983.
Claims priority of application No. 109145694 (TW), filed on Dec. 23, 2020.
Prior Publication US 2022/0199583 A1, Jun. 23, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 23/49894 (2013.01); H01L 23/5383 (2013.01); H01L 23/5387 (2013.01); H01L 24/08 (2013.01); H01L 2224/08225 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A 3D package configuration, comprising:
a package substrate; and
a folded flexible circuit board structure vertically stacked on the package substrate and electrically connected therewith through package substrate bonding pads thereof, comprising:
a folded flexible circuit board formed by folding a cross-shaped flexible circuit board, wherein the cross-shaped flexible circuit board comprises a first surface and a second surface opposite to each other, and the cross-shaped flexible circuit board has a first die bonding zone formed on the first surface and at least one second die bonding zone formed on the first surface or the second surface;
at least one first semiconductor die bonded to the first die bonding zone and electrically connected to the cross-shaped flexible circuit board; and
at least one second semiconductor die bonded to the at least one second die bonding zone and electrically connected to the cross-shaped flexible circuit board;
wherein the cross-shaped flexible circuit board comprises:
a cross-shaped flexible insulating substrate;
a circuit formed on a surface of the cross-shaped flexible insulating substrate; and
an cross-shaped insulating layer overlaying the circuit;
wherein, the first die bonding zone comprises a plurality of first die bonding pads electrically connected to the circuit to make the first semiconductor die electrically connected to the circuit through the first die bonding pads, and the at least one second die bonding zone comprises a plurality of second die bonding pads electrically connected to the circuit to make the at least one second semiconductor die electrically connected to the circuit through the second die bonding pads, and a plurality of package substrate bonding pads under the first die bonding zone are formed on the second surface of the cross-shaped flexible circuit board, and each of the package substrate bonding pads is electrically connected to each of the first die bonding pads corresponding thereof through a conductive hole;
wherein, the at least one second semiconductor die is vertically stacked above the at least one first semiconductor die.