US 12,255,172 B2
Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
Gary S. Gillotti, North Wales, PA (US); and Racheli Herskowits, Philadelphia, PA (US)
Assigned to Kulicke and Soffa Industries, Inc., Fort Washington, PA (US)
Filed by Kulicke and Soffa Industries, Inc., Fort Washington, PA (US)
Filed on Jan. 12, 2023, as Appl. No. 18/096,179.
Application 18/096,179 is a division of application No. 16/890,823, filed on Jun. 2, 2020, granted, now 11,581,285.
Claims priority of provisional application 62/857,027, filed on Jun. 4, 2019.
Prior Publication US 2023/0170325 A1, Jun. 1, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/66 (2006.01)
CPC H01L 24/78 (2013.01) [H01L 22/12 (2013.01); H01L 22/14 (2013.01); H01L 24/85 (2013.01); H01L 2224/78621 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A method of determining a bonding status between a wire and at least one bonding location of a workpiece, the method comprising the steps of:
(a) bonding a portion of the wire to the at least one bonding location of the workpiece using a bonding tool of a wire bonding machine;
(b) detecting, during step (a), at least two of (i) a deformation characteristic related to bonding the portion of the wire, (ii) a bond force characteristic related to bonding the portion of the wire, and (iii) a transducer characteristic of a transducer of the wire bonding machine; and
(c) determining the bonding status of the portion of the wire bonded to the at least one bonding location in step (a) using information detected in step (b).