US 12,255,170 B2
Semiconductor package, electronic apparatus, and method for manufacturing semiconductor package
Yasushi Otsuka, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/638,083
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Jun. 17, 2020, PCT No. PCT/JP2020/023721
§ 371(c)(1), (2) Date Feb. 24, 2022,
PCT Pub. No. WO2021/044703, PCT Pub. Date Mar. 11, 2021.
Claims priority of application No. 2019-161196 (JP), filed on Sep. 4, 2019.
Prior Publication US 2022/0208718 A1, Jun. 30, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 27/146 (2006.01)
CPC H01L 24/73 (2013.01) [H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 27/14683 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/48221 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/3511 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a substrate that includes a front surface;
a plurality of wires, wherein
each wire of the plurality of wires has a first end and a second end, and
the front surface of the substrate is connected to the first end of each wire of the plurality of wires;
a semiconductor element that includes a first surface and a second surface, wherein
the first surface is opposite to the second surface, and
the second end of each wire of the plurality of wires is connected to the first surface of the semiconductor element;
a bonding portion configured to bond a first part of the second surface of the semiconductor element and the front surface of the substrate; and
a plurality of protrusions configured to protrude from the front surface of the substrate to a second part of the second surface of the semiconductor element, wherein
the second part corresponds to a remaining part of the second surface other than the first part.