US 12,255,165 B2
Electronic package and carrier thereof and method for manufacturing the same
Chi-Ren Chen, Taichung (TW); Po-Yung Chang, Taichung (TW); Pei-Geng Weng, Taichung (TW); Yuan-Hung Hsu, Taichung (TW); Chang-Fu Lin, Taichung (TW); and Don-Son Jiang, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Mar. 12, 2024, as Appl. No. 18/602,396.
Application 18/602,396 is a division of application No. 17/369,029, filed on Jul. 7, 2021, granted, now 12,027,484.
Claims priority of application No. 110120226 (TW), filed on Jun. 3, 2021.
Prior Publication US 2024/0321798 A1, Sep. 26, 2024
Int. Cl. H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 24/14 (2013.01) [H01L 21/56 (2013.01); H01L 23/31 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 23/562 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method for manufacturing a carrier, comprising:
forming a carrier body on a support, the carrier body including an insulating portion and at least one circuit portion bonded to the insulating portion, wherein a plurality of conductors are embedded in the insulating portion and electrically connected with the circuit portion, wherein the insulating portion includes at least one dielectric layer, and wherein a plurality of opening regions are formed in the dielectric layer, and each of the conductors is formed in each of the opening regions, wherein an upper surface of the dielectric layer, walls of the plurality of opening regions and sides of the conductors are formed with a first seed layer;
removing the support; and
forming at least one electrical contact pad on the insulating portion, wherein the electrical contact pad covers at least two of the plurality of conductors via a second seed layer, and the second seed layer is in direct contact with end faces of the conductors.