US 12,255,163 B2
Bond pads for semiconductor die assemblies and associated methods and systems
Bharat Bhushan, Taichung (TW); Akshay N. Singh, Boise, ID (US); Keizo Kawakita, Hiroshima (JP); and Bret K. Street, Meridian, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Feb. 7, 2022, as Appl. No. 17/666,437.
Claims priority of provisional application 63/232,581, filed on Aug. 12, 2021.
Prior Publication US 2023/0048311 A1, Feb. 16, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/08 (2013.01) [H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/80 (2013.01); H01L 25/0657 (2013.01); H01L 2224/03848 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05583 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05687 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/29187 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/80895 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06548 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1436 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor die assembly, comprising:
a first semiconductor die including a first bond pad on a first side of the first semiconductor die; and
a second semiconductor die including a second bond pad on a second side of the second semiconductor die, wherein:
the first bond pad is aligned and bonded to the second bond pad at a bonding interface therebetween; and
at least one of the first and second bond pads include a first copper layer having primarily a first crystallographic orientation and a second copper layer having primarily a second crystallographic orientation different than the first crystallographic orientation, the first copper layer located at the bonding interface,
wherein the first bond pad is connected to a through-substrate via (TSV) extending through the first semiconductor die and configured to couple the first bond pad to a conductive structure on a third side of the first semiconductor die, the third side opposite to the first side.