US 12,255,159 B2
Antenna chip packaging structure and method for preparing same
Yayuan Xue, Jiangyin (CN)
Assigned to SJ Semiconductor(Jiangyin) Corporation, Jiangyin (CN)
Filed by SJ Semiconductor(Jiangyin) Corporation, Jiangyin (CN)
Filed on Dec. 9, 2021, as Appl. No. 17/546,473.
Claims priority of application No. 202011453915.X (CN), filed on Dec. 9, 2020; and application No. 202022961113.1 (CN), filed on Dec. 9, 2020.
Prior Publication US 2022/0181278 A1, Jun. 9, 2022
Int. Cl. H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 21/4857 (2013.01); H01L 21/568 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method for preparing an antenna chip packaging structure, comprising:
step 1: providing a first support substrate, and forming a redistribution layer on the first support substrate;
step 2: sequentially forming, above the redistribution layer, a first antenna layer electrically connected to the redistribution layer, a first connection structure connected to a part of the first antenna layer, and a first packaging layer covering the first antenna layer, the first connection structure, and the redistribution layer, followed by polishing the first packaging layer to expose a top surface of the first connection structure;
step 3: sequentially forming, above the first packaging layer, a second antenna layer electrically connected to the first connection structure, a second connection structure connected to the second antenna layer, and a second packaging layer covering the second antenna layer, the second connection structure, and the first packaging layer, followed by polishing the second packaging layer to expose a top surface of the second connection structure;
step 4: forming, above the second packaging layer, a third antenna layer electrically connected to the second connection structure;
step 5: bonding a second support substrate above the third antenna layer and the second packaging layer;
step 6: removing the first support substrate, forming an under-bump-metal (UBM) layer below the redistribution layer, then removing the second support substrate; and
step 7: forming a solder ball on the UBM layer and connecting the antenna chip to the UBM layer.