US 12,255,158 B2
Components for millimeter-wave communication
Neelam Prabhu Gaunkar, Chandler, AZ (US); Georgios Dogiamis, Chandler, AZ (US); Telesphor Kamgaing, Chandler, AZ (US); Diego Correas-Serrano, Tempe, AZ (US); and Henning Braunisch, Phoenix, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 25, 2020, as Appl. No. 16/911,543.
Prior Publication US 2021/0407934 A1, Dec. 30, 2021
Int. Cl. H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01P 3/00 (2006.01); H01P 3/08 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01P 3/003 (2013.01); H01P 3/08 (2013.01); H01P 3/081 (2013.01); H01L 2223/6627 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A microelectronic support for millimeter-wave communication, comprising:
a millimeter-wave communication transmission line, wherein the transmission line includes a trace in a metal layer, wherein the trace is electrically coupled to a via by a via pad in the metal layer; and
a ground plane in the metal layer, wherein one or more metal portions contact the via pad and the ground plane.