US 12,255,157 B2
Semiconductor package device with integrated inductor and manufacturing method thereof
Wen-Shiang Liao, Miaoli County (TW); and Huan-Neng Chen, Taichung (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on May 10, 2023, as Appl. No. 18/314,984.
Application 17/808,997 is a division of application No. 15/964,881, filed on Apr. 27, 2018, granted, now 11,380,632, issued on Jul. 5, 2022.
Application 18/314,984 is a continuation of application No. 17/808,997, filed on Jun. 26, 2022, granted, now 11,699,669.
Prior Publication US 2023/0275045 A1, Aug. 31, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01)
CPC H01L 23/645 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01F 27/24 (2013.01); H01F 2027/2809 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
forming an interconnect structure over a semiconductor substrate, wherein the interconnect structure comprises:
a magnetic core;
a conductive coil winding around the magnetic core and electrically insulated from the magnetic core, wherein the conductive coil comprises horizontally-extending conductive lines and vertically-extending conductive vias electrically connecting the horizontally-extending conductive lines, wherein the magnetic core and the conductive coil are arranged in an inductor zone of the interconnect structure; and
a connecting metal line adjacent to and on an outside of the inductor zone, the connecting metal line being electrical isolated from the inductor zone,
wherein the vertically-extending conductive vias comprise first conductive vias in contact with a first one of the horizontally-extending conductive lines, second conductive vias overlapping the first conductive vias and in contact with a second one of the horizontally-extending conductive lines opposite to the first one of the horizontally-extending conductive lines, and a third conductive via between the first conductive vias and the second conductive vias,
wherein the connecting metal line is between, and non-overlapped with, the first conductive via and the second conductive vias vertically from a cross-sectional view.