US 12,255,156 B2
Semiconductor package with riveting structure between two rings and method for forming the same
Chien Hung Chen, Taipei (TW); Shu-Shen Yeh, Taoyuan (TW); Po-Chen Lai, Hsinchu (TW); Po-Yao Lin, Zhudong Township (TW); and Shin-Puu Jeng, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jun. 16, 2023, as Appl. No. 18/336,303.
Application 18/336,303 is a continuation of application No. 17/372,694, filed on Jul. 12, 2021, granted, now 11,721,644.
Claims priority of provisional application 63/183,125, filed on May 3, 2021.
Prior Publication US 2023/0326881 A1, Oct. 12, 2023
Int. Cl. H01L 23/16 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/58 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 23/16 (2013.01); H01L 23/3185 (2013.01); H01L 23/585 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for forming a semiconductor package, comprising:
mounting a semiconductor device on a surface of a package substrate;
placing a first ring and a second ring adjacent to each other, wherein the first ring has an opening, wherein the second ring covers the opening;
after placing the first ring and the second ring, forcing portions of the second ring into the opening of the first ring to form a ring structure assembly, wherein a protruding part of the second ring extends into the opening of the first ring, wherein forcing portions of the second ring into the opening of the first ring reshapes the second ring; and
attaching the ring structure assembly to the package substrate.