US 12,255,153 B2
Wire bond wires for interference shielding
Abiola Awujoola, Pleasanton, CA (US); Zhuowen Sun, Campbell, CA (US); Wael Zohni, Campbell, CA (US); Ashok S. Prabhu, San Jose, CA (US); and Willmar Subido, San Jose, CA (US)
Assigned to Adeia Semiconductor Technologies LLC, San Jose, CA (US)
Filed by Adeia Semiconductor Technologies LLC, San Jose, CA (US)
Filed on Sep. 21, 2023, as Appl. No. 18/371,222.
Application 18/371,222 is a continuation of application No. 17/893,725, filed on Aug. 23, 2022, granted, now 11,810,867.
Application 17/893,725 is a continuation of application No. 16/715,524, filed on Dec. 16, 2019, granted, now 11,462,483, issued on Oct. 4, 2022.
Application 16/715,524 is a continuation of application No. 16/127,110, filed on Sep. 10, 2018, granted, now 10,559,537, issued on Feb. 11, 2020.
Application 16/127,110 is a continuation of application No. 15/804,122, filed on Nov. 6, 2017, granted, now 10,115,678, issued on Oct. 30, 2018.
Application 15/804,122 is a continuation of application No. 15/344,990, filed on Nov. 7, 2016, granted, now 9,812,402, issued on Nov. 7, 2017.
Application 15/344,990 is a continuation of application No. 14/880,967, filed on Oct. 12, 2015, granted, now 9,490,222, issued on Nov. 8, 2016.
Prior Publication US 2024/0047376 A1, Feb. 8, 2024
Int. Cl. H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/03 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 23/49811 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 25/03 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13076 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/17051 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/215 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/4942 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73259 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85455 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1052 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/2075 (2013.01); H01L 2924/20751 (2013.01); H01L 2924/20754 (2013.01); H01L 2924/3025 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a substrate of a system-in-package, wherein the substrate comprises a first side and a second side opposite the first side;
a first and a second microelectronic device coupled to the first side of the substrate;
an EMI shield comprising a plurality of wire bond wires having first ends coupled to the first side of the substrate and second ends extending away therefrom, wherein the second microelectronic device is separated from the first microelectronic device by at least a portion of the EMI shield; and
a conductive cover, wherein:
the conductive cover extends along a top portion of the system-in-package; and
the conductive cover extends along at least a portion of one or more sides of the system-in-package.