| CPC H01L 23/552 (2013.01) [H01L 21/32131 (2013.01); H01L 23/3107 (2013.01); H01L 25/0655 (2013.01)] | 23 Claims |
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1. A semiconductor device, comprising:
a substrate;
a first semiconductor die disposed over the substrate;
a second semiconductor die disposed over the substrate;
a conductive post disposed over the substrate between the first semiconductor die and second semiconductor die;
an encapsulant deposited over the substrate;
a shielding layer formed over the encapsulant and on the conductive post; and
a first slot formed in the shielding layer over the first semiconductor die, wherein the first slot includes,
a first linear portion,
a second linear portion oriented perpendicular to the first linear portion, and
a curved portion connecting the first linear portion and the second linear portion.
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