US 12,255,151 B2
Module
Yoshihito Otsubo, Nagaokakyo (JP); and Yukio Yamamoto, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto-Fu (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Aug. 3, 2021, as Appl. No. 17/392,344.
Application 17/392,344 is a continuation of application No. PCT/JP2020/004904, filed on Feb. 7, 2020.
Claims priority of application No. 2019-021886 (JP), filed on Feb. 8, 2019.
Prior Publication US 2021/0366839 A1, Nov. 25, 2021
Int. Cl. H01L 23/552 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/552 (2013.01) [H01L 23/3675 (2013.01); H01L 23/49811 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06572 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A module comprising:
a substrate having a first main surface and including wiring;
a first component having a circuit surface, mounted on the first main surface such that the circuit surface faces the first main surface, and having a ground terminal on the circuit surface;
a first sealing resin disposed to cover the first main surface and the first component; and
a heat dissipation portion provided along an upper surface of the first sealing resin, wherein a portion of the heat dissipation portion is disposed over a top surface of the first component in a depth lower than a top surface of the first sealing resin,
wherein the wiring is connected to the ground terminal, and the module further comprises a heat conducting member connecting the wiring and the heat dissipation portion.