US 12,255,148 B2
Power distribution structure and method
Shih-Wei Peng, Hsinchu (TW); Te-Hsin Chiu, Hsinchu (TW); and Jiann-Tyng Tzeng, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Feb. 17, 2021, as Appl. No. 17/178,029.
Claims priority of provisional application 63/018,028, filed on Apr. 30, 2020.
Prior Publication US 2021/0343650 A1, Nov. 4, 2021
Int. Cl. H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/50 (2006.01); H01L 23/528 (2006.01); H01L 27/06 (2006.01)
CPC H01L 23/5386 (2013.01) [H01L 23/50 (2013.01); H01L 23/5286 (2013.01); H01L 24/94 (2013.01); H01L 27/0688 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) package, the IC package comprising:
a first die comprising front and back sides corresponding to opposing surfaces of a first semiconductor wafer, the front side comprising a first signal routing structure and one or more first IC devices electrically connected to the first signal routing structure, the back side comprising a first power distribution structure;
a second die comprising front and back sides corresponding to opposing surfaces of a second semiconductor wafer, the front side comprising a second signal routing structure and one or more second IC devices electrically connected to the second signal routing structure, the back side comprising a second power distribution structure; and
a third power distribution structure positioned between the first and second power distribution structures and electrically connected to each of the first and second power distribution structures.