US 12,255,147 B2
Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein
Jeremy Ecton, Gilbert, AZ (US); Brandon Marin, Gilbert, AZ (US); Srinivas Pietambaram, Chandler, AZ (US); and Suddhasattwa Nad, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Apr. 29, 2021, as Appl. No. 17/243,784.
Prior Publication US 2022/0352076 A1, Nov. 3, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/5383 (2013.01) [H01L 23/49894 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16227 (2013.01)] 24 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a first glass layer having a first surface and an opposing second surface;
a second glass layer having a first surface and an opposing second surface;
an etch stop layer abutting the first surface of the first glass layer and abutting the first surface of the second glass layer, wherein the first glass layer comprises an opening extending from the first surface of the first glass layer at the etch stop layer to the second surface of the first glass layer;
a bridge within the opening of the first glass layer, wherein the bridge is attached to the etch stop layer; and
a through-glass conductive via extending through the second glass layer and the etch stop layer, wherein the through-glass conductive via is electrically attached to the bridge.