US 12,255,145 B2
Multi-layer line structure
Hiroshi Kudo, Tokyo (JP); and Takamasa Takano, Tokyo (JP)
Assigned to DAI NIPPON PRINTING CO., LTD., Tokyo (JP)
Filed by Dai Nippon Printing Co., Ltd., Tokyo (JP)
Filed on Nov. 17, 2023, as Appl. No. 18/512,125.
Application 18/512,125 is a continuation of application No. 17/352,921, filed on Jun. 21, 2021, granted, now 11,862,564.
Application 17/352,921 is a continuation of application No. 16/736,973, filed on Jan. 8, 2020, granted, now 11,217,530, issued on Jan. 4, 2022.
Application 17/352,921 is a continuation of application No. 16/736,946, filed on Jan. 8, 2020, granted, now 11,069,618, issued on Jul. 20, 2021.
Application 16/736,973 is a continuation of application No. 16/151,543, filed on Oct. 4, 2018, granted, now 10,586,768, issued on Mar. 10, 2020.
Application 16/736,973 is a continuation of application No. 16/151,543, filed on Oct. 4, 2018, granted, now 10,586,768, issued on Mar. 10, 2020.
Application 16/151,543 is a continuation of application No. 15/636,859, filed on Jun. 29, 2017, granted, now 10,121,748, issued on Nov. 6, 2018.
Application 15/636,859 is a continuation of application No. 14/704,096, filed on May 5, 2015, granted, now 9,735,108, issued on Aug. 15, 2017.
Application 14/704,096 is a continuation of application No. PCT/JP2013/079910, filed on Nov. 5, 2013.
Claims priority of application No. 2012-243593 (JP), filed on Nov. 5, 2012.
Prior Publication US 2024/0088040 A1, Mar. 14, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/532 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01)
CPC H01L 23/53238 (2013.01) [H01L 21/02063 (2013.01); H01L 21/02071 (2013.01); H01L 21/02126 (2013.01); H01L 21/02274 (2013.01); H01L 21/31058 (2013.01); H01L 21/31116 (2013.01); H01L 21/7685 (2013.01); H01L 21/76877 (2013.01); H01L 23/49822 (2013.01); H01L 23/5226 (2013.01); H01L 23/5329 (2013.01); H01L 23/53295 (2013.01); H05K 3/4688 (2013.01); H01L 21/76832 (2013.01); H01L 21/76834 (2013.01); H01L 21/76885 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0231 (2013.01); H05K 3/4679 (2013.01); H05K 2201/068 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A multi-layer line structure comprising:
a first line layer;
a first organic resin film located on the first line layer, the first organic resin film covering and being in contact with a side surface of the first line layer and at least a part of the top surface of the first line layer;
a second line layer located on the first organic resin film;
an insulating layer located on the second line layer, the insulating layer including an inorganic layer and a second organic resin film, the inorganic layer covering and being in contact with a side surface of the second line layer and at least a part of the top surface of the second line layer, and the second organic resin film being located on the inorganic layer;
a third line layer located on the second organic resin film; and
a third organic resin film located on the third line layer, the third organic resin film covering and being in contact with a side surface of the third line layer and at least a part of the top surface of the third line layer.