| CPC H01L 23/5286 (2013.01) [H01L 21/823821 (2013.01); H01L 21/823871 (2013.01); H01L 23/5226 (2013.01); H01L 27/0924 (2013.01)] | 20 Claims |

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1. A cell on an integrated circuit, comprising:
a fin structure;
an intermediate fin structure connection metal track disposed in an intermediate fin structure connection metal layer above the fin structure, the intermediate fin structure connection metal track being connected to the fin structure;
a first intermediate gate connection metal track disposed in an intermediate gate connection metal layer above the intermediate fin structure connection metal layer, the first intermediate gate connection metal track being connected to the intermediate fin structure connection metal track; and
a second intermediate gate connection metal track disposed in the intermediate gate connection metal layer, wherein both the first intermediate gate connection metal track and the second intermediate gate connection metal track extend in a first direction, wherein the first intermediate gate connection metal track is located at a top of the cell in a second direction perpendicular to the first direction, and wherein the second intermediate gate connection metal track is located at a bottom of the cell in the second direction.
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