US 12,255,128 B2
Silicon spacers with improved adhesion and semiconductor device assemblies incorporating the same
Aibin Yu, Singapore (SG); and Yee Chon Chin, Singapore (SG)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Feb. 18, 2022, as Appl. No. 17/676,037.
Prior Publication US 2023/0268263 A1, Aug. 24, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/3142 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/48225 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A semiconductor device assembly comprising:
a package substrate;
a silicon spacer disposed on an upper surface of the substrate, the silicon spacer having a plurality of trenches extending into the silicon spacer from a top surface thereof;
one or more semiconductor dice disposed over the silicon spacer; and
an encapsulant material at least partially encapsulating the one or more semiconductor dice and the package substrate, the encapsulant material at least partially filling the plurality of trenches of the silicon spacer,
wherein areas of the plurality of trenches under the one or more semiconductor devices are substantially free from the encapsulant material.