US 12,255,124 B2
Jet impingement cooling with bypass fluid portion for high power semiconductor devices
John Mookken, Scottsdale, AZ (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Feb. 13, 2023, as Appl. No. 18/167,998.
Claims priority of provisional application 63/370,389, filed on Aug. 4, 2022.
Prior Publication US 2024/0047304 A1, Feb. 8, 2024
Int. Cl. H01L 23/473 (2006.01)
CPC H01L 23/4735 (2013.01) 20 Claims
OG exemplary drawing
 
1. A jet impingement cooling assembly for semiconductor devices, comprising:
an inlet chamber configured to receive an inlet fluid flow;
a jet plate having jet nozzles formed therein and coupled to the inlet chamber, and positioned to direct a jet fluid portion of the inlet fluid flow from the inlet chamber through the jet nozzles;
an outlet chamber positioned to receive the jet fluid portion once the jet fluid portion has passed through the jet nozzles; and
at least one bypass nozzle in fluid connection with the inlet chamber and configured to direct a bypass fluid portion of the inlet fluid flow into the outlet chamber with the jet fluid portion to thereby define an outlet fluid flow.