US 12,255,123 B2
Micro heat transfer arrays, micro cold plates, and thermal management systems for semiconductor devices, and methods for using and making such arrays, plates, and systems
Onnik Yaglioglu, Thousand Oaks, CA (US); Richard T. Chen, San Jose, CA (US); Will J. Tan, Pasadena, CA (US); Jia Li, Valencia, CA (US); Uri Frodis, Los Angeles, CA (US); Nina C. Levy, Los Angeles, CA (US); and Dennis R. Smalley, Newhall, CA (US)
Assigned to Microfabrica Inc., Van Nuys, CA (US)
Filed by Microfabrica Inc., Van Nuys, CA (US)
Filed on Mar. 18, 2022, as Appl. No. 17/699,049.
Claims priority of provisional application 63/162,826, filed on Mar. 18, 2021.
Prior Publication US 2023/0207426 A1, Jun. 29, 2023
Int. Cl. H01L 23/473 (2006.01); F28F 3/12 (2006.01); F28F 13/06 (2006.01); H01L 21/48 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/4735 (2013.01) [F28F 3/12 (2013.01); F28F 13/06 (2013.01); H01L 21/4871 (2013.01); H01L 21/4882 (2013.01); H01L 23/473 (2013.01); H05K 7/20254 (2013.01); H05K 7/20272 (2013.01); H05K 7/20281 (2013.01); F28F 2260/02 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A thermal management system for a semiconductor device comprising:
(a) at least one micro cold plate, comprising:
(I) at least one fluid inlet selected from the group consisting of: a) at least one header, and b) at least one manifold;
(II) at least one fluid outlet selected from the group consisting of: a) at least one header, and b) at least one manifold;
(III) a hybrid microjet and microchannel heat transfer array, comprising:
a) a plurality of microjet structures for directing a heat transfer fluid from the at least one fluid inlet onto at least one surface of a primary heat exchange region that is selected from the group consisting of:
(A) at least one surface of a heat source;
(B) at least one surface in proximity to the at least one heat source surface wherein a separation distance between the at least one surface onto which jetting occurs and the at least one heat source surface is selected from the group consisting of: (i) 10 mm, (ii) 5 mm, (iii) 2 mm, (iv) 1 mm, (v) 500 um, (vi) <=200 um, (vii) <=100 um, (viii) <=50 um, (ix) <=20 um, and (x) <=10 um;
(C) at least one surface of a solid material separated from at least one surface of a heat source by a gap that is occupied by at least one highly conductive transfer material that is selected from the group consisting of: (i) a different solid, (ii) a semi-liquid, and (3) a liquid, wherein a thickness of the gap is selected from the group consisting of: (i) 10 mm, (ii) 5 mm, (iii) 2 mm, (iv) 1 mm, (v) 500 um, (vi) <=200 um, (vii) <=100 um, (viii) <=50 um, (ix) <=20 um, and (x) <=10 um; and
(D) at least one surface of a solid that is in intimate contact with at least one surface or a plurality of separate surfaces of a heat source; and
b) a plurality of post jetting microchannel flow paths to direct the heat transfer fluid from the primary heat exchange region to the at least one outlet header or manifold, wherein the at least one surface of the primary heat exchange region onto which jetting occurs is closer, in the jetting direction, to the at least one surface of the heat source than are the microchannel flow paths;
(b) at least one flow path to move heated fluid, from the fluid outlet to at least one heat exchanger;
(c) at least one flow path to move cooled fluid, directly or indirectly, from the at least one heat exchanger back into the fluid; and
(d) at least one pump functionally configured to direct the fluid through the a loop including to, through, and out of the at least one cold plate and to, through, and out of the heat exchanger.