| CPC H01L 23/473 (2013.01) [H05K 7/20772 (2013.01); H05K 7/20809 (2013.01)] | 29 Claims |
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17. A water-cooled server comprising:
a tank;
a plurality of planar microelectronic modules spaced apart in the tank, with water channels created at spaces between the plurality of microelectronic modules;
a motherboard coupled to each of the plurality of microelectronic modules;
a water conduit connecting between a water input to the tank and a water output from the tank;
a variable pump, connected in series with the water conduit, the pump operable to adjust water pressure on command from a server controller;
wherein each module of the plurality of microelectronic modules is cooled by water flowing in water channels adjacent to the plurality of microelectronic modules,
wherein the system controller controls the variable pump to maintain a balance between single phase cooling and two-phase cooling in the water-cooled server, adaptable to changes in the server cooling demand, and
wherein the motherboard is protected from water intrusion via a water seal disposed between a water surface and the motherboard.
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