US 12,255,121 B2
Power semiconductor cooling assembly
Sebastian Pedro Rosado, Nuremberg (DE); and Karthik Debbadi, Kronshagen (DE)
Assigned to HAMILTON SUNDSTRAND CORPORATION, Charlotte, NC (US)
Filed by Hamilton Sundstrand Corporation, Charlotte, NC (US)
Filed on Aug. 9, 2022, as Appl. No. 17/883,960.
Claims priority of application No. 21190901 (EP), filed on Aug. 11, 2021.
Prior Publication US 2023/0052028 A1, Feb. 16, 2023
Int. Cl. H01L 23/473 (2006.01); H01L 23/367 (2006.01)
CPC H01L 23/473 (2013.01) [H01L 23/3672 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A power switch module comprising:
a semiconductor die; and
a source conductive busbar;
a drain conductive busbar;
wherein the source conductive busbar and the drain conductive busbar are directly sintered to the semiconductor die; and
a dielectric coolant fluid wherein the busbar and the semiconductor die mounted thereto are immersed in the dielectric coolant fluid.