US 12,255,118 B2
Package structure and method of fabricating the same
Yu-Sheng Lin, Hsinchu County (TW); Po-Yao Lin, Hsinchu County (TW); Shu-Shen Yeh, Taoyuan (TW); Chin-Hua Wang, New Taipei (TW); and Shin-Puu Jeng, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 18, 2023, as Appl. No. 18/353,901.
Application 18/353,901 is a continuation of application No. 17/367,401, filed on Jul. 4, 2021, granted, now 11,756,854.
Claims priority of provisional application 63/163,040, filed on Mar. 18, 2021.
Prior Publication US 2023/0378019 A1, Nov. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/367 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01); H01L 23/00 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 23/3672 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73204 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A structure, comprising:
a package disposed on a substrate;
a lid structure disposed on the substrate and surrounding the package, wherein the lid structure comprises an opening;
a heat dissipation structure disposed on the lid structure, wherein the heat dissipation structure is a heat sink comprising:
fin structures;
a fin base supporting the fin structures;
a step structure supporting the fin base; and
a protruding portion disposed on the step structure, wherein the protruding portion is filled into the opening of the lid structure and laterally surrounded by the lid structure.