US 12,255,092 B2
Substrate processing apparatus
Junnosuke Taguchi, Iwate (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Oct. 15, 2021, as Appl. No. 17/502,615.
Claims priority of application No. 2020-180260 (JP), filed on Oct. 28, 2020.
Prior Publication US 2022/0130712 A1, Apr. 28, 2022
Int. Cl. H01L 21/68 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/68764 (2013.01) [H01L 21/67103 (2013.01); H01L 21/68728 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A substrate processing apparatus comprising:
a rotary table provided inside a processing container;
a stage provided on an upper surface of the rotary table in order to mount a substrate thereon, and configured to revolve by a rotation of the rotary table;
a lid formed of a material with a heat adsorption rate higher than that of the stage;
a heater in communication with the stage and the lid, the heater configured to heat the substrate mounted on the stage; and
a rotation shaft provided at a location that rotates together with the rotary table to freely rotate while supporting the stage, and including a low heat conductivity body formed of a material with a heat conductivity lower than that of the stage,
wherein,
the lid is in communication with the rotation shaft, and proximate to a central region of the stage;
the stage includes a flange on a lower surface thereof,
a first clamp and a second clamp form the rotation shaft with the flange inserted between the first and second clamps in a vertical direction of the stage; and
the low heat conductivity body includes at least one of the first clamp and the second clamp.