US 12,255,086 B2
Processing method of wafer
Kohei Tsujimoto, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Aug. 19, 2020, as Appl. No. 16/997,332.
Claims priority of application No. 2019-151169 (JP), filed on Aug. 21, 2019.
Prior Publication US 2021/0057261 A1, Feb. 25, 2021
Int. Cl. H01L 21/683 (2006.01); B24B 7/22 (2006.01); H01L 21/304 (2006.01)
CPC H01L 21/6836 (2013.01) [B24B 7/228 (2013.01); H01L 21/304 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68381 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A processing method of a wafer for grinding a back surface of the wafer on which a plurality of devices are formed on a front surface in such a manner as to be marked out by a plurality of planned dividing lines that intersect, the processing method comprising:
an adhesive tape sticking step of sticking an adhesive tape to the front surface of the wafer;
a thermocompression bonding sheet disposing step of disposing a thermocompression bonding sheet on the adhesive tape stuck to the front surface of the wafer;
an integration step of heating the thermocompression bonding sheet and pressing the thermocompression bonding sheet by a flat member to execute pressure bonding of the thermocompression bonding sheet to the adhesive tape and integrate the thermocompression bonding sheet with the wafer;
a grinding step of holding a side of the thermocompression bonding sheet on a chuck table of a grinding apparatus and grinding the wafer into a desired thickness while supplying grinding water to the back surface of the wafer, after the integration step is executed; and
a separation step of carrying out the wafer integrated with the thermocompression bonding sheet from the chuck table and separating the thermocompression bonding sheet from the adhesive tape, wherein
the thermocompression bonding sheet is partly heated or cooled, and a temperature difference is generated to separate the thermocompression bonding sheet from the adhesive tape in the separation step.