US 12,255,083 B2
Semiconductor die pickup apparatus
Jae Yeong Jung, Icheon-si (KR); and Jong Kyu Moon, Icheon-si (KR)
Assigned to SK hynix Inc., Icheon-si (KR)
Filed by SK hynix Inc., Icheon-si (KR)
Filed on Jun. 23, 2022, as Appl. No. 17/847,682.
Claims priority of application No. 10-2022-0008806 (KR), filed on Jan. 20, 2022.
Prior Publication US 2023/0230860 A1, Jul. 20, 2023
Int. Cl. H01L 21/67 (2006.01)
CPC H01L 21/67132 (2013.01) 16 Claims
OG exemplary drawing
 
1. A semiconductor die pickup apparatus comprising:
a tape peeler for peeling a mount tape from a semiconductor die; and
a flipper for holding the semiconductor die,
wherein the tape peeler includes:
a housing part having a groove that faces the mount tape;
a cover part covering the groove;
a roller part connected to the cover part; and
a vacuum part performing vacuum suction within the groove,
wherein the roller part moves to wind the cover part,
wherein the cover part includes a first end portion and a second end portion, the second end portion positioned on an opposite end in relation to the first end portion,
wherein the first end portion of the cover part is connected to the housing part, and
wherein the second end portion of the cover part is connected to the roller part.