US 12,255,082 B2
Substrate processing method
Yuta Hamashima, Kumamoto (JP); and Jun Nonaka, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jul. 13, 2022, as Appl. No. 17/863,427.
Claims priority of application No. 2021-116117 (JP), filed on Jul. 14, 2021.
Prior Publication US 2023/0015936 A1, Jan. 19, 2023
Int. Cl. H01L 21/67 (2006.01)
CPC H01L 21/67034 (2013.01) [H01L 21/67051 (2013.01); H01L 21/67057 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A substrate processing method that collectively executes a drying process for a plurality of substrates in a wet state thereof, comprising:
a first arrangement step that arranges the plurality of substrates in a storage area of a chamber that is capable of accommodating the plurality of substrates where the chamber has a gastight space that includes the storage area where a liquid is stored and a drying area that is located above the storage area;
a first replacement step that supplies an organic solvent from a first organic solvent nozzle to the plurality of substrates to replace a liquid that is attached to the plurality of substrates with an organic solvent, after the first arrangement step;
a second arrangement step that arranges the plurality of substrates in the drying area, after the first replacement step;
a second replacement step that supplies a vapor of a hydrophobizing agent from a hydrophobizing agent nozzle to the plurality of substrates to replace an organic solvent that is attached to the plurality of substrates with a hydrophobizing agent, after the second arrangement step;
a third arrangement step that arranges the plurality of substrates in the storage area, after the second replacement step;
a third replacement step that supplies an organic solvent from the first organic solvent nozzle to the plurality of substrates to replace a hydrophobizing agent that is attached to the plurality of substrates with an organic solvent, after the third arrangement step; and
a chamber cleaning step that supplies a vapor of an organic solvent from a second organic solvent nozzle to the drying area in a state where a liquid is stored in the storage area and the plurality of substrates are dipped in a liquid, to clean the chamber, after the third replacement step.