US 12,255,076 B2
Method for manufacturing leadless semiconductor package with wettable flanks
Ian Harvey Arellano, Bauang (PH); Aaron Cadag, Calamba (PH); and Ela Mia Cadag, Calamba (PH)
Assigned to STMICROELECTRONICS, INC., Calamba (PH)
Filed by STMICROELECTRONICS, INC., Calamba (PH)
Filed on Feb. 7, 2024, as Appl. No. 18/435,915.
Application 18/435,915 is a division of application No. 17/353,684, filed on Jun. 21, 2021, granted, now 11,929,259.
Application 17/353,684 is a continuation of application No. 16/264,822, filed on Feb. 1, 2019, granted, now 11,069,601, issued on Jul. 20, 2021.
Claims priority of provisional application 62/635,872, filed on Feb. 27, 2018.
Prior Publication US 2024/0178006 A1, May 30, 2024
Int. Cl. H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01)
CPC H01L 21/4821 (2013.01) [H01L 23/3121 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
forming a package, the forming of the package including:
forming a die pad;
positioning a die on the die pad;
forming a plurality of conductive leads, each of the plurality of conductive leads includes a first portion extending in a first direction and a second portion extending in a second direction transverse to the first direction;
forming encapsulation material on the die pad, the die, and the plurality of conductive leads,
the encapsulation material including a first side, a second side opposite to the first side, and a plurality of third sides,
the first portion of each of the plurality of conductive leads includes a first surface at the first side of the encapsulation material, and a second surface at one of the plurality of third sides of the encapsulation material,
the second portion of each of the plurality of conductive leads includes a third surface at the second side of the encapsulation material;
positioning the package on an adhesive layer such that the second side of the encapsulation material faces the adhesive layer; and
forming a conductive layer on the first and second surfaces of the first portion of each of the plurality of conductive leads.