US 12,255,071 B2
Grinding apparatus
Satoru Fujimura, Tokyo (JP); Kyohei Ichiishi, Tokyo (JP); and Yujiro Sudo, Tokyo (JP)
Assigned to Disco Corporation, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Dec. 21, 2021, as Appl. No. 17/645,334.
Claims priority of application No. 2020-213681 (JP), filed on Dec. 23, 2020.
Prior Publication US 2022/0199407 A1, Jun. 23, 2022
Int. Cl. H01L 21/304 (2006.01); B24B 7/22 (2006.01); B24B 49/04 (2006.01); H01L 21/66 (2006.01); H01L 21/78 (2006.01)
CPC H01L 21/304 (2013.01) [B24B 7/228 (2013.01); B24B 49/04 (2013.01); H01L 21/78 (2013.01); H01L 22/12 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A grinding apparatus that grinds a separation surface having recesses and projections in a wafer generated by being separated from an ingot, the grinding apparatus comprising:
a holding table that holds the wafer;
a grinding unit that grinds a separation surface of the wafer held by the holding table;
a detecting unit that detects a physical quantity used for determination of a state of exposure of the separation surface, wherein the separation surface is exposed when it faces the grinding unit and not exposed when it faces the holding table; and
a control unit having an exposure determining unit that determines, prior to a grinding operation by the grinding unit, the state of exposure of the separation surface on a basis of the physical quantity detected by the detecting unit.