US 12,255,062 B2
Integrate rinse module in hybrid bonding platform
Xin-Hua Huang, Xihu Township (TW); Ping-Yin Liu, Yonghe (TW); Hung-Hua Lin, Taipei (TW); Hsun-Chung Kuang, Hsinchu (TW); Yuan-Chih Hsieh, Hsinchu (TW); Lan-Lin Chao, Sindian (TW); Chia-Shiung Tsai, Hsinchu (TW); and Xiaomeng Chen, Baoshan Township (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Nov. 14, 2023, as Appl. No. 18/509,053.
Application 17/655,638 is a division of application No. 16/569,019, filed on Sep. 12, 2019, granted, now 11,282,697, issued on Mar. 22, 2022.
Application 16/569,019 is a division of application No. 15/269,346, filed on Sep. 19, 2016, granted, now 10,665,449, issued on May 20, 2020.
Application 18/509,053 is a continuation of application No. 17/655,638, filed on Mar. 21, 2022, granted, now 11,854,795.
Application 15/269,346 is a continuation of application No. 13/888,921, filed on May 7, 2013, granted, now 9,446,467, issued on Sep. 20, 2016.
Claims priority of provisional application 61/785,993, filed on Mar. 14, 2013.
Prior Publication US 2024/0087879 A1, Mar. 14, 2024
Int. Cl. B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 20/02 (2006.01); B23K 20/233 (2006.01); B23K 20/24 (2006.01); H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01); B23K 101/42 (2006.01)
CPC H01L 21/02068 (2013.01) [B23K 1/0016 (2013.01); B23K 1/206 (2013.01); B23K 20/026 (2013.01); B23K 20/233 (2013.01); B23K 20/24 (2013.01); H01L 24/89 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); H01L 2224/80894 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/80986 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus configured for cleaning a wafer, the apparatus comprising:
an integrated cleaning station comprising:
a chamber;
a plurality of storages outside of the chamber;
a nozzle in the chamber and connected to the plurality of storages, wherein the nozzle is configured to dispense liquids from different ones of the plurality of storages to the wafer; and
a plurality of containers in the chamber, wherein the integrated cleaning station is configured to collect the liquids dispensed from different ones of the plurality of storages into different ones of the plurality of containers.