US 12,255,061 B2
Substrate processing method
Tetsuya Emoto, Kyoto (JP); Shigeru Yamamoto, Kyoto (JP); Daiki Fujii, Kyoto (JP); Kenji Edamitsu, Kyoto (JP); Keiji Iwata, Kyoto (JP); Yuya Kawai, Kyoto (JP); and Kenichi Ito, Kyoto (JP)
Assigned to SCREEN HOLDINGS CO., LTD., (JP)
Appl. No. 18/007,267
Filed by SCREEN Holdings Co., Ltd., Kyoto (JP)
PCT Filed Jun. 22, 2021, PCT No. PCT/JP2021/023609
§ 371(c)(1), (2) Date Jan. 27, 2023,
PCT Pub. No. WO2022/024590, PCT Pub. Date Feb. 3, 2022.
Claims priority of application No. 2020-130881 (JP), filed on Jul. 31, 2020.
Prior Publication US 2023/0290631 A1, Sep. 14, 2023
Int. Cl. B08B 3/08 (2006.01); H01L 21/02 (2006.01)
CPC H01L 21/02057 (2013.01) [B08B 3/08 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A substrate processing method for processing a substrate, comprising:
supplying a water repellent agent to the substrate;
supplying dilute isopropyl alcohol to the substrate after supplying the water repellent agent, the dilute isopropyl alcohol being obtained by diluting isopropyl alcohol;
supplying isopropyl alcohol to the substrate after supplying the dilute isopropyl alcohol; and
drying the substrate after supplying the isopropyl alcohol; wherein isopropyl alcohol is supplied immediately before the drying, and wherein the dilute isopropyl alcohol includes DIW (deionized water) and isopropyl alcohol, and wherein the ratio of the DIW to the isopropyl alcohol is at least 10% and no greater than 30%.