US 12,255,057 B2
Specimen carrier and method for manufacturing specimen carrier
Akira Tashiro, Hamamatsu (JP); Masahiro Kotani, Hamamatsu (JP); and Takayuki Ohmura, Hamamatsu (JP)
Assigned to HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
Appl. No. 17/795,964
Filed by HAMAMATSU PHOTONICS K.K., Hamamatsu (JP)
PCT Filed Dec. 1, 2020, PCT No. PCT/JP2020/044710
§ 371(c)(1), (2) Date Jul. 28, 2022,
PCT Pub. No. WO2021/157169, PCT Pub. Date Aug. 12, 2021.
Claims priority of application No. 2020-017108 (JP), filed on Feb. 4, 2020.
Prior Publication US 2023/0095349 A1, Mar. 30, 2023
Int. Cl. H01J 49/04 (2006.01)
CPC H01J 49/0418 (2013.01) 15 Claims
OG exemplary drawing
 
1. A sample support body used for ionizing a sample, comprising:
an insulating substrate having a first surface, a second surface opposite to the first surface, and a measurement region formed with a plurality of through holes opening to the first surface and the second surface;
a frame having a first face facing the first surface and a second face opposite to the first face, in which an opening part opening to the first face and the second face is formed to correspond to the measurement region, the frame being formed on the first surface such that the opening part overlaps the measurement region when viewed from a thickness direction of the substrate;
an adhesive layer formed between the first surface and the first face to bond the substrate and the frame, the adhesive layer having a protruding portion protruding from an inner surface of the opening part toward the measurement region when viewed from the thickness direction; and
a conductive layer having a first portion provided along the inner surface of the opening part, a second portion provided along the first surface of the measurement region, and a third portion provided along a surface of the protruding portion so as to connect the first portion and the second portion.