US 12,255,051 B2
Multi-shape voltage pulse trains for uniformity and etch profile tuning
Linying Cui, Cupertino, CA (US); James Rogers, Los Gatos, CA (US); Daniel Sang Byun, Campbell, CA (US); Rajinder Dhindsa, Pleasanton, CA (US); and Keith Hernandez, Santa Clara, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Nov. 9, 2022, as Appl. No. 17/983,926.
Prior Publication US 2024/0153741 A1, May 9, 2024
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32128 (2013.01) [H01J 37/32146 (2013.01); H01J 37/32091 (2013.01); H01J 2237/3341 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A method for processing a substrate in a plasma processing system, the method comprising:
receiving, by a waveform generator, a first synchronization waveform signal from a controller;
delivering, by the waveform generator, a first burst of first voltage pulses to an electrode assembly disposed within the plasma processing system after receiving a first portion of the first synchronization waveform signal, wherein
at least one first parameter of the first voltage pulses is set to a first value based on a first waveform parameter within the first portion of the first synchronization waveform signal; and
delivering, by the waveform generator, a second burst of second voltage pulses to the electrode assembly disposed within the plasma processing system after receiving a second portion of the first synchronization waveform signal, wherein
the at least one first parameter of the first voltage pulses is set to a second value based on a difference in the first waveform parameter within the second portion of the first synchronization waveform signal.