US 12,255,025 B2
Multilayer electronic component
YoonA Park, Suwon-si (KR); KangHa Lee, Suwon-si (KR); Myung Jun Park, Suwon-si (KR); WooKyung Sung, Suwon-si (KR); JinSoo Park, Suwon-si (KR); and SoEun Choi, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Sep. 13, 2022, as Appl. No. 17/943,605.
Claims priority of application No. 10-2021-0193638 (KR), filed on Dec. 31, 2021.
Prior Publication US 2023/0215655 A1, Jul. 6, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/224 (2013.01); H01G 4/232 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed while having the dielectric layer interposed therebetween, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a first connection portion disposed on the third surface and a first band portion extended from the first connection portion onto a portion of the first surface;
a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extended from the second connection portion onto a portion of the first surface;
a first insulating layer disposed on the first connection portion;
a second insulating layer disposed on the second connection portion;
a first plating layer disposed on the first band portion;
a second plating layer disposed on the second band portion;
a first additional electrode layer disposed between the first connection portion and the third surface; and
a second additional electrode layer disposed between the second connection portion and the fourth surface,
wherein the first insulating layer and the second insulating layer include glass,
wherein the first or second external electrode includes copper (Cu), and the first or second additional electrode layer includes at least one of nickel (Ni) and an alloy of nickel (Ni),
wherein the glass included in the first and second insulating layers include Si, and
wherein the molar fraction of Si included in the first and second insulating layers is 20 mol % or more and 65 mol % or less.