US 12,255,022 B2
Multilayer electronic component having insulating layer which includes fluorine-based organic material
Kwang Yeun Won, Suwon-si (KR); Jong Ho Lee, Suwon-si (KR); Yoo Jeong Lee, Suwon-si (KR); Hyung Jong Choi, Suwon-si (KR); Chung Yeol Lee, Suwon-si (KR); So Jung An, Suwon-si (KR); Woo Kyung Sung, Suwon-si (KR); and Myung Jun Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Sep. 20, 2022, as Appl. No. 17/948,499.
Claims priority of application No. 10-2021-0194498 (KR), filed on Dec. 31, 2021.
Prior Publication US 2023/0215646 A1, Jul. 6, 2023
Int. Cl. H01G 4/232 (2006.01); H01G 4/224 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/2325 (2013.01) [H01G 4/224 (2013.01); H01G 4/30 (2013.01)] 35 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including dielectric layers and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface;
a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface;
an insulating layer including a first insulating layer disposed on the first connection portion and a second insulating layer disposed on the second connection portion;
a first plating layer disposed on the first band portion and extends in the first direction to an end portion of the first insulating layer disposed on the first connection portion; and
a second plating layer disposed on the second band portion and extends in the first direction to an end portion of the second insulating layer disposed on the second connection portion,
wherein the insulating layer includes a fluorine-based organic material, and
wherein the insulating layer further includes at least one selected from the group consisting of TiO2, BaTiO3, Al2O3, and BaO.