US 12,255,021 B2
Multilayer electronic component
Kyung Sik Kim, Suwon-si (KR); Si Taek Park, Suwon-si (KR); Min Young Choi, Suwon-si (KR); and Jae Sung Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Nov. 28, 2022, as Appl. No. 17/994,629.
Claims priority of application No. 10-2021-0191316 (KR), filed on Dec. 29, 2021.
Prior Publication US 2023/0207202 A1, Jun. 29, 2023
Int. Cl. H01G 4/12 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/1227 (2013.01) [H01G 4/012 (2013.01); H01G 4/30 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, wherein the body is sintered; and
external electrodes disposed on the body,
wherein the body includes a capacitance formation portion forming capacitance by including the first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween and margin portions disposed on opposite side surfaces of the capacitance formation portion in the third direction, respectively,
at least one of the dielectric layers and at least one of the margin portions include a BaTiO3-based main component, and
the at least one of the margin portions includes an oxide including Zn as a first accessory component and includes Zn in an amount of 0.5 mol % or more and less than 1.5 mol % based on 100 mol % of Ti included in the at least one of the margin portions.