US 12,255,020 B2
Ceramic electronic component
Han Seong Jung, Suwon-si (KR); and Ga Young An, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on May 18, 2022, as Appl. No. 17/747,666.
Claims priority of application No. 10-2022-0008650 (KR), filed on Jan. 20, 2022.
Prior Publication US 2023/0230767 A1, Jul. 20, 2023
Int. Cl. H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/1227 (2013.01) [H01G 4/2325 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A ceramic electronic component comprising:
a body including dielectric layers and internal electrodes; and
external electrodes disposed on the body and connected to the internal electrodes,
wherein the dielectric layers include a plurality of dielectric crystal grains, an average number of dielectric crystal grains per unit thickness (1 μm) across a thickness of an entirety of at least one the dielectric layers is 6 or more, and td is 2.0 μm or less, td being an average thickness of at least one of the dielectric layers,
wherein 1<td/te≤3.0, te being an average thickness of at least one of the internal electrodes, and te≥1 μm.