US 12,255,019 B2
Multilayer electronic component
Jin Bok Shin, Suwon-si (KR); Yu Ra Shin, Suwon-si (KR); Seung Yong Lee, Suwon-si (KR); Jung Hyun An, Suwon-si (KR); Yong Hwa Lee, Suwon-si (KR); Da Hyeon Go, Suwon-si (KR); Choong Seop Jeon, Suwon-si (KR); and Min Soo Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 11, 2024, as Appl. No. 18/632,624.
Application 18/632,624 is a continuation of application No. 17/512,063, filed on Oct. 27, 2021, granted, now 11,984,264.
Claims priority of application No. 10-2020-0189099 (KR), filed on Dec. 31, 2020.
Prior Publication US 2024/0258031 A1, Aug. 1, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/1209 (2013.01) [H01G 4/30 (2013.01); H01G 4/012 (2013.01); H01G 4/232 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and
external electrodes disposed on the body,
wherein the cover portion includes a plurality of dielectric grains and a plurality of pores,
Gn/Pn is more than 10, in which Gn is number of dielectric grains included in the cover portion and Pn is number of pores included in the cover portion, and
Ps/Gs is more than 1.5, in which Gs is an average size of the dielectric grains included in the cover portion and Ps is an average size of the pores included in the cover portion.