US 12,255,013 B2
Film pasting assembly and assembling method
Yongpeng Chang, Kunshan (CN); Tao Zhou, Kunshan (CN); Xiaoceng Zhou, Kunshan (CN); and Hang Cheng, Kunshan (CN)
Assigned to LANTO ELECTRONIC LIMITED, Kunshan (CN)
Filed by Lanto Electronic Limited, Kunshan (CN)
Filed on Nov. 15, 2022, as Appl. No. 17/987,385.
Claims priority of application No. 202210086291.5 (CN), filed on Jan. 25, 2022.
Prior Publication US 2023/0238176 A1, Jul. 27, 2023
Int. Cl. H01F 41/02 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); B32B 37/26 (2006.01)
CPC H01F 41/02 (2013.01) [B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 37/12 (2013.01); B32B 37/26 (2013.01); B32B 2250/44 (2013.01); B32B 2307/748 (2013.01); B32B 2405/00 (2013.01); B32B 2457/00 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A film pasting assembly for assisting to assemble a coil and a magnet, the film pasting assembly comprising:
a base film;
a first adhesive layer formed annularly and arranged on the base film;
a first release film, comprising a first annular portion and a first handle portion, the first annular portion being adhered to the first adhesive layer, and the first handle portion extending outwards from an outer circumference of the first annular portion;
a second adhesive layer arranged on the base film; and
a second release film, comprising a second annular portion and a second handle portion, the second annular portion being adhered to the second adhesive layer, and the second handle portion extending inwards from an inner circumference of the second annular portion,
wherein the second release film is located on an inner side of the first release film, and a size of an inner circumference of the first annular portion is equal to that of an outer circumference of the second annular portion;
wherein, the first release film is a removable film disposed on the first adhesive layer, and the second release film is a removable film disposed on the second adhesive layer; the first release film is configured to be torn apart to expose the first adhesive layer on the base film, and the second release film is configured to be torn apart to expose the second adhesive layer on the base film.