US 12,254,632 B2
Thermal image processing device, thermal image processing module, thermal image processing method, and recording medium
Kenichiro Nosaka, Osaka (JP); Aki Yoneda, Hyogo (JP); Shinichi Shikii, Nara (JP); and Mototaka Yoshioka, Osaka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 17/780,803
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
PCT Filed Dec. 4, 2020, PCT No. PCT/JP2020/045332
§ 371(c)(1), (2) Date May 27, 2022,
PCT Pub. No. WO2021/117645, PCT Pub. Date Jun. 17, 2021.
Claims priority of application No. 2019-224490 (JP), filed on Dec. 12, 2019.
Prior Publication US 2022/0414888 A1, Dec. 29, 2022
Int. Cl. G06T 7/11 (2017.01); G01J 5/48 (2022.01); H04N 5/33 (2023.01); G01J 5/00 (2022.01)
CPC G06T 7/11 (2017.01) [G01J 5/485 (2022.01); H04N 5/33 (2013.01); G01J 2005/0077 (2013.01); G06T 2207/10048 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A thermal image processing device comprising:
an acquirer that acquires a thermal image from a thermal image sensor;
a first processor that performs, on a high temperature pixel indicating a temperature higher than a first temperature among a plurality of pixels included in the thermal image acquired, image processing for decreasing the temperature indicated by the high temperature pixel; and
a second processor that performs high frequency enhancement processing for enhancing a high frequency component included in a converted image, the converted image being the thermal image on which the image processing has been performed.