US 12,254,621 B2
Method, electronic device and operating method of electronic device and manufacture of semiconductor device
Do-Nyun Kim, Seoul (KR); Min-Cheol Kang, Hwaseong-si (KR); Kihyun Kim, Seongnam-si (KR); Jaehoon Kim, Seoul (KR); and Jaekyung Lim, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR); and Seoul National University R&DB Foundation, Seoul (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jul. 1, 2022, as Appl. No. 17/856,130.
Claims priority of application No. 10-2021-0111863 (KR), filed on Aug. 24, 2021.
Prior Publication US 2023/0069493 A1, Mar. 2, 2023
Int. Cl. G06K 9/00 (2022.01); G01N 21/95 (2006.01); G06T 7/00 (2017.01); H01L 21/66 (2006.01)
CPC G06T 7/001 (2013.01) [G01N 21/9505 (2013.01); H01L 22/12 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An operating method of an electronic device for manufacture of a semiconductor device, the method comprising:
receiving, at the electronic device, a computer-aided design (CAD) image for a lithography process of the semiconductor device;
generating, at the electronic device, a first scanning electron microscope (SEM) image and a first segment (SEG) image, the first SEM image and the first SEG image generated from the CAD image by using a machine learning-based circuit,
wherein the first SEG image includes information about a location of a defect;
calculating, at the electronic device, a SEM loss based on the first SEM image and a SEG loss based on the first SEG image;
calculating, at the electronic device, a cost based on the SEM loss and the SEG loss; and
updating, at the electronic device, the machine learning-based circuit based on the cost.