US 12,254,366 B2
System to track hot-section flowpath components in assembled condition using high temperature material markers
Sridhar Pakanati, Bangalore (IN); Srinivasan Swaminathan, Bangalore (IN); Arindam Ghosh, Bangalore (IN); Ambarish Ghosh, Bangalore (IN); and Gayathri Honnenahalli Niranjana Murthy, Bangalore (IN)
Assigned to General Electric Company, Schenectady, NY (US); and Indian Institute of Science, Bengaluru (IN)
Appl. No. 18/710,703
Filed by General Electric Company, Schenectady, NY (US); and Indian Institute of Science, Bengaluru (IN)
PCT Filed Nov. 28, 2022, PCT No. PCT/US2022/051083
§ 371(c)(1), (2) Date May 16, 2024,
PCT Pub. No. WO2023/097079, PCT Pub. Date Jun. 1, 2023.
Claims priority of application No. 202141055216 (IN), filed on Nov. 29, 2021.
Prior Publication US 2024/0338543 A1, Oct. 10, 2024
Int. Cl. G06K 19/06 (2006.01)
CPC G06K 19/06037 (2013.01) 19 Claims
OG exemplary drawing
 
1. A marker comprising:
a dielectric base material;
a refractive film, having etching, disposed onto the dielectric base material to obtain a thickness modulated film; and
a coating of refractive material disposed on the thickness modulated film to obtain an identification pattern,
wherein a spectral distribution of light is associated with the identification pattern, and wherein the spectral distribution of light is dependent on at least two of the refractive film, the thickness modulated film, the dielectric base material, and a silicon interface between the refractive film and the dielectric base material.