US 12,253,901 B2
Systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices
Nikos Kaburlasos, Folsom, CA (US); Rodrigo De Oliveira Vivi, Lithia, FL (US); Phani Kumar Kandula, Murugeshpalya (IN); Marc Beuchat, Folsom, CA (US); Mark J. Luckeroth, Portland, OR (US); Eric J. M. Moret, Beaverton, OR (US); David N. Lombard, Rossmoor, CA (US); John Kelbert, Aptos, CA (US); and Brad Bittel, Beaverton, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 30, 2021, as Appl. No. 17/490,290.
Prior Publication US 2023/0101997 A1, Mar. 30, 2023
Int. Cl. G06F 1/32 (2019.01); G06F 1/08 (2006.01); G06F 1/3228 (2019.01); G06F 1/3296 (2019.01)
CPC G06F 1/3296 (2013.01) [G06F 1/08 (2013.01); G06F 1/3228 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A processor comprising:
a communication interface configured to receive, from a first hardware component, instructions assigned to the processor for execution;
temperature-measurement circuitry configured to monitor an on-chip temperature of the processor; and
control logic configured to:
determine whether the processor is active or idle;
determine whether the on-chip temperature of the processor exceeds a first threshold;
based on determining that the processor is idle and that the on-chip temperature of the processor exceeds the first threshold, disable one or more idle-mode power-saving features of the processor; and
selectively adjust one or more operating parameters of the processor to keep the on-chip temperature of the processor between the first threshold and a second threshold, the second threshold being greater than the first threshold.